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600mil LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 11x-dip-switch SPST.

AcDbSymbolTableRecord 100 AcDbLinetypeTableRecord 2 BYLAYER 70 0.
0.116097 0.993238 vertex -4.18518 -5.59382 7.89166.
Coilcraft XFL2010, Shielded power inductor.
LGA-18 12x12x3.82mm (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPM3550EGLE/document_id/5102/ Rohm LGA, 10.

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