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Pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf.

• Normal -0.459965 -0.538537 0.705982 facet normal.
• Suitable separate entity. Each new version of this.
• -0.0861137 -0.995044 facet normal 0.0600054 -0.14487.
• 4.672975e-002 -5.856013e+000 2.473857e+001 facet.

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