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4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST 1P1T tactile switch D Switch, single pole double throw | | | | | Q1, Q2, Q3, Q4, Q5 R1, R2, R23, R24 R3, R21, R27, R28 R4, R6, R7 | 3 | A1M | Potentiometer | | | R30 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-8/SOIC-8/TO-99-8"/> 8fe829edc2a52299443ce1d2193e2aa04d060c17 From b22080a808f5ee5eddd0b607f432f7fa2c4fb139 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add kicad schematic, some diylc noodling Binary files /dev/null and b/Panels/FireballSpellVertSmaller.png differ Binary files a/3D Printing/Panels/BLADE BARRIER.png create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/analogoutput_12mm.kicad_mod create mode 100644 Fireball/Fireball.kicad_dru create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel.pro Binary files a/3D Printing/AD&D 1e spell names in Filmoscope.

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