Labels Milestones
BackHttp://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole IDC header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x17 2.00mm single row Through hole socket strip THT 1x37 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x20 2.54mm single row Through hole angled pin header SMD 2x25 2.54mm double row Through hole angled socket strip SMD 1x21 1.00mm single row style2 pin1 right Through hole socket strip SMD 1x28 1.00mm single row Through hole socket strip SMD 1x40 2.00mm single row Through hole Samtec HPM power header series 3.81mm post length THT 1x18 2.00mm single row Through hole angled pin header SMD 1x13 2.00mm single row Through hole socket strip THT 1x38 2.54mm single row Through hole Samtec HPM power header series 3.81mm post length THT 1x05 2.00mm single row Surface mounted pin header THT 1x16 2.54mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x30, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x40, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x15, 1.00mm pitch, double rows Through hole straight Samtec HPM power header series.
- Same "printed page" as.
- (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16), generated with kicad-footprint-generator JST ZE.