3
1
Back

Pitch, 1.854mm thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf), generated with kicad-footprint-generator connector JST EH series connector, S20B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with.

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