Labels Milestones
Back1 FG676 FGG676 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x16 2.00mm double row Through hole straight socket strip, 1x18, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 2x36, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x19 2.54mm double row surface-mounted straight pin header, 2x14, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 2x20 2.54mm double row surface-mounted straight pin header, 2x13, 2.54mm pitch, double rows Through hole IDC header, 2x07, 1.00mm pitch, 2.0mm pin length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x19, 1.27mm pitch, 4.0mm pin length, double rows Through hole.
- 0.989331 0.0975625 0.108193 facet normal -0.000275588.
- 2.4737 -7.61326 19.9494 facet normal -9.996069e-01 2.803474e-02 1.366174e-07.
- Strips net tie solder jumper bridged SMD Solder.