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BackMarked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 53398-1071 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2410, 24 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.25.
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