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Annular, M2, DIN965 mounting hole 2.1mm no annular Mounting Hole 4.3mm, M4, ISO7380 mounting hole 3.2mm m3 Mounting Hole 2.7mm, M2.5, ISO14580 mounting hole 4mm no annular m6 Mounting Hole 4.3mm, M4, DIN965 mounting hole 4.3mm m4 din965 Mounting Hole 2.2mm, M2 mounting hole 6mm no annular m2.5 Mounting Hole 2.2mm, no annular, M3, DIN965 mounting hole 4.3mm m4 iso7380 Mounting Hole 4.3mm, no annular, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-5, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 5.45mm TO-3P-3, Vertical, RM 2.54mm, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 2.29mm IPAK TO-251-3, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-11, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.7mm staggered type-1 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220F-11, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220F-15 Vertical RM 2.54mm TO-218-2, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted.

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