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0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header SMD 2x21 1.27mm double row Through hole pin header THT 1x04 2.00mm single row Surface mounted pin header SMD 1x14 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x03 1.27mm double row Through hole angled socket strip THT 1x18 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x16 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x23 1.27mm single row style2 pin1 right Through hole socket strip THT 2x21 1.27mm double row Through hole angled socket strip, 2x06, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x32 1.27mm double row surface-mounted straight socket strip, 1x20, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through.

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