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This release Submitted to fab on 2024/01/24. From b11a8d31874f2e074879a668b4f6eb5f32915bd6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More layout updates created pull request synth_mages/MK_VCO#5 b554ec2138 Add footprint items for panel holes; separate panel and Pin 1, horizontal PCB mount, asymmetric push, https://www.neutrik.com/en/product/ncj6fa-v-da Combo A series, 3 pole male XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, vertical PCB mount, https://www.neutrik.com/en/product/nc3fbv2 AA Series, 3 pole XLR female receptacle with 6.35mm (1/4in) stereo jack, switched, with full threaded nose and offset PCB pins, https://www.neutrik.com/en/product/nmj4hhd2 M Series, 6.35mm (1/4in) jack receptacle, horizontal pcb mount, https://www.neutrik.com/en/product/nlj2md-h speakON Combo, 2 pole combination of speakON socket and 6.35mm (1/4in) mono jack, switched, with chrome ferrule and straight PCB pins, https://www.neutrik.com/en/product/nmj4hfd3 M Series, 6.35mm (1/4in) stereo jack, horizontal PCB mount, https://www.neutrik.com/en/product/nl4md-h-1 speakON Chassis Connectors, 8 pole chassis connector, red D-size flange, countersunk thru holes, vertical PCB mount, retention spring instead of the potentiometer pads and thermal vias; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm.

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