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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header SMD 2x27 2.00mm double row surface-mounted straight pin header, 2x15, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x38, 1.00mm pitch, double rows Surface mounted socket strip THT 1x39 2.54mm single row style2 pin1 right Through hole angled pin header, 2x28, 2.54mm pitch, 8.51mm socket length, single row Through hole IDC header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip THT 1x09 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x03 1.00mm double row Through hole straight socket strip, 1x24, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x14, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x03 2.54mm single row Through hole straight socket strip, 2x19, 2.00mm pitch, single row Through hole IDC header, 2x20, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x12 1.27mm single row Through hole angled pin header, 2x28, 2.54mm pitch, double rows Through hole angled pin header, 2x37, 2.00mm pitch, 4.2mm pin length, double rows Through.

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