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THT 61x61mm Signal Relay, 10x6mm, 2 Form C, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPDT form c vertical Omron Relay, SPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay, SPST, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT Finder 40.51 Pitch 5mm relay dpdt fujitsu tht Kemet signal relay, DPDT, double coil latching through hole PLCC, 28 pins, through hole 3.3mm, height 2.5, Wuerth electronics 9774060360 (https://katalog.we-online.de/em/datasheet/9774060360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas X2QFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S14B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4, Wuerth electronics 9774060982 (https://katalog.we-online.de/em/datasheet/9774060982.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-50DS-0.5V, 50 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xxx-DV, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-18DP-2DSA, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556441-da-01-de-LEITERPLATTENKL__PTSM_0_5__8_2_5_H_THR.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-13-3.5-H pitch 3.5mm size 38.5x7.6mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PT-1,5-9-3.5-H, 9 pins, pitch 10mm, size 85x9mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-204 45Degree pitch 10mm Varistor, diameter 9mm, width 3.8mm, pitch 5mm size 122x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix PTSM-0,5-4-2.5-V-THR, vertical (cable from top), 6 pins, pitch 2.54mm, drill diameter 0.8mm Test point with 2 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strip SMD 2x10 1.27mm double row Through hole Samtec HPM power header series 11.94mm post length, 1x05, 5.08mm pitch, single row male, vertical entry, strain relief clip Harwin LTek Connector, 4 pins, pitch 10mm, size 55x9mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-209 45Degree pitch 10mm Varistor, diameter 9mm, width 3.4mm, pitch 5mm size 20x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00294, 9 pins, pitch 5mm, size 65x9.8mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block.

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