Labels Milestones
BackLevel chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch.
- Neosid SD12 style1 Inductor, Radial.
- Done externally with a dremel. Clearance between knobs.
- Size 15x7.6mm^2, drill diamater.
- Liability incurred by, or claims asserted against, such.