Labels Milestones
BackShrouded banana panel socket, through-hole, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm.
- Strip, HLE-109-02-xxx-DV-BE-A, 9 Pins.
- 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc7593.pdf (page 432)), generated.