synth_tools

Back

SPST Copal_CHS-10B, Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6 HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 3x3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations.

New Pull Request

Labels Milestones