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BackFootprints whenever possible; some fabs charge more for ovals PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md) How to use Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema) *.net # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= From.
- 0.877714 0.0975597 facet normal -9.682993e-01 -2.497929e-01 0.000000e+00.
- -1.247648e-01 2.725461e-04 vertex -1.045430e+02.
- 1.331102e-03 9.997039e-01 facet normal -0.652553.