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Section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x49 1.27mm double row Through hole straight pin header, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x24, 2.00mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x15, 2.00mm pitch, 4.2mm pin length, double rows Through hole socket strip SMD 2x10 1.27mm double row Through hole IDC box header, 2x12, 1.00mm pitch, double rows Through hole straight Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch, single row Surface mounted socket strip SMD 1x15 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x09 2.54mm double row Through hole angled pin header THT 2x02 1.27mm double.

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