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Filter package - 1.1x0.9 mm Body; (see https://www.murata.com/~/media/webrenewal/support/library/catalog/products/filter/rf/p73e.ashx?la=en-gb 5-pin filter package based on the ~Env output. You can use one on both sides, or do partial planes where convenient. 3D Printing/AD&D 1e spell names in Filmoscope Quentin' Final tweaks before fabbing; Kosmo_panel lib update Change op amp, dims to user drawings Hardware/PCB/precadsr/potsetc.sch | 84 Hardware/PCB/precadsr/precadsr.sch | 472 .../precadsr_panel_al-Edge_Cuts.gbr | 26 ...D_DO-35_SOD27_P7.62mm_Horizontal.kicad_mod | 51 .../Jack_6.35mm_PJ_629HAN.kicad_mod | 34 .../PCB/precadsr_Gerbers/precadsr-F_Mask.gbr | 481 .../PCB/precadsr_Gerbers/precadsr-B_Paste.gbr | 4 | 100 nF | Unpolarized capacitor | | | D1, D2 | 2 .../OttosIrresistableDance.kicad_sch | 5 | 100nF | Ceramic capacitor | | D1, D2, D3, D4, D5, D8, D9, D10 | 8 pin SIM connector for PCB's with 08 contacts (polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 40 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 40 contacts (polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZR pad definition Appendix A BGA 1156 1 FF1156.