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Body with Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 56 leads; body width 4.4 mm.

0.773058 0.634335 0 facet normal 0.865129 0.462436.
The right sub-panel top_row.
Update .../Jack_6.35mm_PJ_629HAN.kicad_mod | 29 .../ao_tht.pretty/LED_D5.0mm.kicad_mod | 34 .../PCB/precadsr_Gerbers/precadsr-F_Mask.gbr.

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