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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator JST PHD series connector, LY20-42P-DT1, 21 Circuits (http://www.molex.com/pdm_docs/sd/5022502191_sd.pdf), generated with kicad-footprint-generator Fuse 0ZRE0005FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf Fuse 0ZRE0016FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf Fuse 0ZRE0033FF, BelFuse, Radial Leaded.

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