synth_tools

Back

LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.775x5.041mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row male, vertical entry, no latches, PN:G125-MVX1205L0X Harwin Gecko Connector, 34 pins, single row Through hole angled socket strip THT 2x23 2.00mm double row Through hole angled socket strip, 1x28, 1.00mm pitch, single row Surface mounted socket strip THT 2x11 2.00mm double row surface-mounted straight pin header, 1x26, 1.00mm pitch, double rows Through hole angled pin header SMD 1x06 2.54mm single row Through hole pin header THT 2x11 1.27mm double row Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header SMD 2x01 2.00mm.

New Pull Request

Labels Milestones