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506CN (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [TSSOP] with exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Piano, row spacing 25.4 mm (1000 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing.

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