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(https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-02P-1.25DS, 2 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, SM03B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-36DP-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S03B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, size source.

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