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20-Lead Frame Chip Scale Package - 4.0x4.0x0.8 mm Body [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 10.8x26.96mm 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.

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