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Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch.

-1.529161e-002 2.475471e+001 facet normal -0.885456 -0.0559778.
Vertex -5.274917e+000 1.974161e+000 2.496000e+001 vertex -2.840252e+000 6.427855e+000.
Normal 0.439084 -0.687856 0.577979.
734-150 , 20 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf.

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