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2x17 1.00mm double row Through hole straight socket strip, 2x29, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header THT 2x02 2.00mm double row surface-mounted straight pin header, 1x24, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header SMD 2x12 1.00mm double row surface-mounted straight socket strip, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole Samtec HPM power header series 11.94mm post length THT 1x17 5.08mm single row Through hole IDC header, 2x05, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x23, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x34 1.27mm double row Through hole socket strip SMD 1x07 1.27mm single row Through hole angled pin header THT 1x17 2.00mm single row Through hole angled pin header, 1x37, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x11 2.00mm single row Surface mounted pin header SMD 1x23 2.54mm single row Through hole pin header THT 1x32 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x05 1.00mm double row Through hole straight socket strip, 1x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header SMD 1x04 2.54mm single row 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP.

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