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50 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 28 top-side contacts, 0.5mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x23 1.00mm double row Through hole angled socket strip SMD 2x12 1.27mm double row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x15 5.08mm single row Surface mounted socket strip THT 1x16 2.00mm single row style2 pin1 right Through hole angled socket strip THT 2x08 2.54mm double row Through hole angled pin header, 2x24, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x09 2.00mm single row style2 pin1 right Through hole socket strip THT 1x09 2.54mm single row Surface mounted pin header THT 1x14 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x32 1.00mm single row style2 pin1 right Through hole pin header SMD 2x17 1.27mm double row Through hole angled pin header SMD 1x22 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x40 1.27mm single row Through hole angled pin header, 1x19, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x39 2.54mm single row male, vertical entry Harwin LTek Connector, 12 pins, pitch 3.5mm, size 18.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 13 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Resistor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx06, With thermal vias in pads, 6 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD.

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