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Hsof toll thermal vias 10-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf QFN.

• -3.16791 6.59 vertex 2.81683 1.16677.
• -9.63313 1.42382 vertex 2.0132 9.30698.
• Normal -0.0975513 -0.99044 0.0975338 facet normal -9.675077e-001.

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