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BackCore to MK's, but it's unclear whether JLCPCB is still the best option. This page is to collect findings from researching other potential fab plants. Our standard design is 1.6mm thick, 2-sided copper clad fiberglass. ENIG is unnecessary. Shipping for minimum order* of Fireball main PCBs (maybe the same form factor, with maybe a little bit of margin // margins from edges h_margin = hole_dist_side + thickness; v_margin = hole_dist_top*5; output_column = width_mm - thickness*2; // How much horizontal space needed for left-hand and right-hand sub-panels right_panel_width = 12; // The Trenches // The diagonal of the potentiometer shaft clf_shaft_notch_diameter = 5.0; // the D shape "removed" from the front Don't put R8 so close to R26 - D36/R47 too close Testing before powering up: Clock In - ~27K to U3-8? No, transistors maybe activate? - Clock in socket with 80 contacts AT ISA 16 bits Bus Edge Connector BUS ISA AT Edge connector PCI bus Edge Connector BUS ISA AT Edge connector PCI bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70 Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for IQRF TR-x2DA(T) modules, http://iqrf.org/weben/downloads.php?id=104 Bluetooth v4.2 + NFC module Modtronix Wireless SX1276 LoRa Module (http://modtronix.com/img/prod/imod/inair9/inair_dimensions.gif Modtronix LoRa inAir inAir9 SX1276 RF 915MHz 868MHz Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth.
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