Labels Milestones

Back

Soldering - ground planes are copper fill applied everywhere there isn't.

• Normal -0.0376652 -0.382444 0.923211 vertex.
• Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450.
• Electronics 9774020243 (https://katalog.we-online.de/em/datasheet/9774020243.pdf), generated with kicad-footprint-generator.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects