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10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, pitch 0.5mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 2x02, 1.27mm pitch, single row Through hole angled socket strip THT 1x13 2.54mm single row Surface mounted socket strip THT 2x04 2.00mm double row Through hole straight socket strip, 2x31, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x17 2.00mm single row Through hole straight pin header, 2x09, 2.00mm pitch, 6.35mm socket length, double rows Through hole IDC header, 2x05, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x10, 2.54mm pitch, double rows Surface mounted pin header THT 1x31 1.27mm single row.

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