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Package; 56 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44.

• -0.635858 -0.771715 -0.0118532 facet normal -9.921821e-01.
• Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf L_CommonMode_Toroid Vertical.

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