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Http://www.ckswitches.com/media/1479/kmr2.pdf tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=9.5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=7.3mm tactile push button, 6x6mm e.g. PHAP33xx series, height=7.3mm tactile push button, 6x6mm e.g. PHAP33xx series, height=13mm FS5700 series pushbutton footswitch, DPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, with Boss Ultra-small-sized Tactile Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL ZIF 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-15 Vertical RM 2.54mm TO-247-5, Vertical, RM 0.9mm, staggered type-1 TO-220F-2, Horizontal, RM 1.27mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-9 Vertical RM 4.58mm IPAK TO-251-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered.

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