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Raster, 2.605x2.703mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x34 1.27mm single row style2 pin1 right Through hole socket strip THT 2x09 1.27mm double row Through hole angled pin header SMD 1x12 1.00mm single row Through hole straight pin header, 2x17, 1.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x06, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header SMD 1x23 2.00mm single row style2 pin1 right Through hole angled pin header SMD 2x09 2.00mm double row surface-mounted straight pin header, 1x07, 1.00mm pitch, double rows Through hole angled pin header, 2x11, 1.00mm pitch, single row Through hole pin header THT 2x24 1.00mm double row Through hole socket strip SMD 1x30 1.27mm single row Through hole IDC header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole.

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