Labels Milestones

Back

1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x31 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x29 1.27mm single row style1 pin1 left Surface mounted socket strip.

• Plan on developing modules which use the Work.
• Mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects