Labels Milestones
Back2,5mm Drill, Soldering, Fischer SK104-STC-STIC, Heatsink, Sheet type, 50x7mm, 2 fixations (solder), Choke, SMD, 10.4x10.4mm 4.8mm height Choke, SMD, 12x12mm 4.5mm height Choke, SMD, 7.3x7.3mm 3.5mm height Choke, SMD, 7.3x7.3mm 3.5mm height Choke, SMD, 6.3x6.3mm 3mm height Choke, SMD, 6.3x6.3mm 3mm height Choke, SMD, 12x12mm 4.5mm height Choke, SMD, 12x12mm 4.5mm height Choke, SMD, 12x12mm 4.5mm height Choke, SMD, 12x12mm 8mm height Inductor SMD Wuerth WE-DD TypM TypS Wuerth Shielded Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint Coilcraft XAL60xx series, https://www.coilcraft.com/pdfs/xal60xx.pdf Coilcraft 0603USB Series Common Mode Choke, https://www.coilcraft.com/pdfs/0805usb.pdf Coilcraft 1812CAN Series Common Mode Line Filter, https://www.we-online.de/katalog/en/WE-SL5/, https://www.we-online.de/katalog/datasheet/744272471.pdf SMT Common Mode Choke, https://www.coilcraft.com/pdfs/1812can.pdf WE-SL5 SMT Common Mode Choke, https://www.coilcraft.com/pdfs/0805usb.pdf Coilcraft 1812CAN Series Common Mode Line Filter, https://www.we-online.de/katalog/en/WE-SL5/, https://www.we-online.de/katalog/datasheet/744272471.pdf SMT Common Mode Choke, https://www.coilcraft.com/pdfs/0603usb.pdf surface mount SMD package for diode bridges, row spacing 5.25 mm (206 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 5.08 mm (200 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), Socket 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET M2 MOSFET.
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