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BackAir coil, https://www.we-online.com/components/products/datasheet/744918254.pdf air coil inductor wurth we cair Semi-Shielded High Saturation Power Inductor, Wuerth Elektronik, Wuerth_HCM-1070, 10.1mmx7.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2508, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_HCM-1050, 10.2mmx7.0mm inductor Wuerth hcm smd Inductor, Vishay, Vishay_IHSM-5832, http://www.vishay.com/docs/34020/ihsm5832.pdf, 16.3mmx8.1mm Inductor, Vishay, Vishay_IHSM-4825, http://www.vishay.com/docs/34019/ihsm4825.pdf, 13.7mmx6.3mm Inductor, Vishay, Vishay_IHSM-4825, http://www.vishay.com/docs/34019/ihsm4825.pdf, 13.7mmx6.3mm Inductor, Vishay, IHLP series, 3.0mmx3.0mm inductor vishay icsm smd Inductor, Wuerth Elektronik, Wuerth_MAPI-2510, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2512, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_HCI-1335, 12.8mmx12.8mm Inductor, Wuerth Elektronik, Wuerth_HCM-1350, 13.5mmx13.3mm Inductor, Wuerth Elektronik, Wuerth_HCM-1390, 12.5mmx13.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2508, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2506, 2.5mmx2.0mm Inductor, Wuerth Elektronik, WE-PD2, SMD, Typ L, Typ XL, Typ XXL, https://katalog.we-online.com/pbs/datasheet/744874001.pdf Choke Coupled Double Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://www.mspindy.com/specifications/AST1109MLTRQ.pdf Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN.