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42 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc0015.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S16B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63R-1P-3.96DSA, 1 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-LC, 30 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator JST SH series connector, S8B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST VH series connector, LY20-36P-DLT1, 18 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator JST GH series connector, B20B-PUDSS.

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