synth_tools

Back

Connector, B20B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0403-5-51, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-132 , 2 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S13B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated with kicad-footprint-generator JST SHL series connector, B7P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 1.5, Wuerth electronics 9774090482 (https://katalog.we-online.de/em/datasheet/9774090482.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/PIC16LF19195-6-7-Data-Sheet-40001873D.pdf#page=718), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-4DP-2DSA, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-8010, 80 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator Hirose series connector, 504050-0591 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 8.6, Wuerth electronics 97730406332 (https://katalog.we-online.com/em/datasheet/97730406332.pdf), generated with kicad-footprint-generator Hirose series connector, BM15B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead dip package, row spacing.

New Pull Request

Labels Milestones