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4x3 grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 1x31, 1.00mm pitch, single row Through hole angled socket strip, 2x16, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x11 2.00mm single row Through hole angled socket strip SMD 1x07 2.54mm single row Through hole angled pin header THT 1x08 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x12, 2.00mm pitch, 4.2mm pin length, single row Through hole straight pin header, 1x33, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x32, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x30 1.27mm single row Through hole pin header THT 2x38 2.00mm double row Through hole angled pin header THT 1x26 2.54mm single row Surface mounted socket strip THT 1x14 2.54mm single row Through hole straight pin header, 1x34, 1.27mm pitch, double rows Through hole angled pin header, 1x40, 2.00mm pitch, double rows Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x22 1.00mm single row Surface mounted socket strip THT 1x21 2.54mm single row style2 pin1 right Through hole angled pin header SMD 1x14 2.00mm single row Through hole socket strip SMD 1x13 2.00mm single row style2 pin1 right Through hole angled pin header SMD 1x09 2.54mm single row (from Kicad 4.0.7!), script generated Through hole socket strip THT 2x17 2.00mm double row surface-mounted straight pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 2x09 1.27mm double row Through hole straight pin header, 1x14, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length, 1x13, 5.08mm pitch, single row Surface mounted pin header THT 1x20 2.00mm single row male, vertical entry, PN:G125-FVX1605L0X Harwin Gecko Connector, 6 pins, pitch 2.5mm, size 12.2x10mm^2, drill diamater 1.15mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-40DS-0.5V, 40 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_noLead_generator.py Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/ Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/ Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin.

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