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5.3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm.

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