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Of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole horizontal IDC header THT 2x15 1.27mm double row Through hole straight socket strip, 2x22, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x11 1.27mm single row Surface mounted socket strip SMD 2x06 1.00mm double row Through hole socket strip SMD 1x03 2.54mm single row Surface mounted pin header SMD.

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