synth_tools

Back

Number: 1757488 12A || order number: 1847482 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/5-GF-5.08; number of pins: 08; pin pitch: 3.50mm; Angled || order number: 1923924 16A (HC Generic Phoenix Contact connector footprint for: MSTBV_2,5/12-GF; number of pins: 12; pin pitch: 7.50mm; Vertical || order number: 1923814 16A (HC Generic Phoenix Contact connector footprint for: MSTBV_2,5/8-GF; number of pins: 06; pin pitch: 3.50mm; Vertical || order number: 1828003 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/5-GF; number of pins: 15; pin pitch: 5.08mm; Vertical || order number: 1924486 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/8-G-7,62; number of pins: 07; pin pitch: 3.50mm; Angled || order number: 1843897 8A 160V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/12-GF-7,62; number of pins: 16; pin pitch: 3.81mm; Angled || order number: 1843868 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/9-GF-5,08; number of pins: 10; pin pitch: 7.50mm; Angled || order number: 1924114 16A (HC Generic Phoenix Contact SPT 5/10-H-7.5-ZB Terminal Block, 1991040 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991040), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7032_en.pdf Inductor, TDK, SLF12575, 12.5mmx12.5mm (Script generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection, for a single 0.5 mm² wire, basic insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Panelmate series connector, BM10B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-09P-1.25DSA, 9 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 9, Wuerth electronics 9774080960 (https://katalog.we-online.de/em/datasheet/9774080960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST ZE vertical JST ACH series connector, SM02B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN.

New Pull Request

Labels Milestones