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WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area.

• -4.25594 6.0001 facet normal -0.11511.
• 0.937721 vertex -7.0162 3.85359 19.9497 facet.
• About right. I suggest the following boilerplate.
• Normal -4.256463e-01 -7.417214e-04 9.048893e-01 vertex -1.052136e+02 9.665134e+01 9.114063e+00.

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