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BackPlastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Kodenshi SG-105 with PCB locator, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 2 mm² wires, basic insulation, conductor diameter 1.4mm, length 8.5mm, width 2.5mm solder Pin_ with flat with hole, hole diameter 1.3mm, wire diameter 1.0mm wire loop with bead as test point, loop diameter 3.8mm, hole diameter 0.7mm, wire diameter 1.0mm test point THT pad THT pad as test Point, diameter 4.0mm Plated Hole as test Point, diameter 2.0mm wire loop with bead as test point, pitch 5.08mm, size 55.9x9.8mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00234, 4 pins, single row Through hole IDC header, 2x12, 2.54mm pitch, single row Through hole angled socket strip, 1x37, 2.54mm pitch, double rows Surface mounted pin header SMD 1x13 1.00mm single row Through hole angled pin header THT 1x26 2.54mm single row style2 pin1 right Through hole angled pin header, 2x38, 2.00mm pitch, 4.2mm pin length, single row.
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