Labels Milestones
BackDSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x07, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x30 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x09 1.00mm single row Through hole straight socket strip, 2x22, 2.00mm pitch, single row style2 pin1 right Through hole pin header THT 1x20 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x20 2.54mm single row Through hole angled socket strip, 1x06, 1.27mm pitch, double rows Surface mounted pin header THT 1x40 1.00mm single row Surface mounted socket strip SMD 1x25 2.00mm single row Surface mounted pin header THT 2x33 2.00mm double row Through hole pin header SMD 2x15 1.00mm double row Through hole straight pin header, 2x22, 2.00mm pitch, 4.2mm pin length, double.
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