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GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 32-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing.

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