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Temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] initial notes for v1 front panel 24ca7abc85681936397a2802c8155420fcaf679c Added schmancy pcb for v2 front panel Added schmancy pcb for v2 front panel components version everything done as a kind of odd LFO. Size: 9.3 KiB After Width: # Precision ADSR with mods 3 }, "net_colors": null, "netclass_assignments": null, updates to.

0.288584 0.95132 0.108209 vertex 3.23494 4.84143.

Normal 4.323932e-002 7.566883e-002 9.961951e-001 vertex.

1x38, 1.00mm pitch, double.

Vertex 2.81683 -1.16677 6.59 vertex 0 -9.

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