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Connector, B30B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.5mm, hole diameter 1.2mm, length 11.3mm, width 3.0mm solder Pin_ with flat fork solder Pin_ with flat fork solder Pin_ loose fit solder Pin_ with flat fork, hole diameter 0.5mm test point SMD pad rectangle square SMD pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 3 pin, 2.0mm square SMD rectangular pad as test Point, diameter 3.0mm 3 pins THT ceramic resonator filter SMD Resomator/Filter 7.2x3.0mm, Murata CSTCC8M00G53-R0; 8MHz resonator, SMD, Farnell (Element.

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