Labels Milestones
BackStrip, HLE-137-02-xxx-DV-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 2x09 2.00mm double row Through hole angled pin header THT 2x34 1.27mm double row surface-mounted straight pin header, 1x19, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x17 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x27 2.00mm double row Through hole angled socket strip, 1x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled.
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